TY - GEN
T1 - Development of a compliant nanothermal interface material
AU - Shaddock, David
AU - Weaver, Stanton
AU - Chasiotis, Ioannis
AU - Shah, Binoy
AU - Zhong, Dalong
PY - 2011
Y1 - 2011
N2 - The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented. [The views expressed are those of the author and do not reflect the official policy or position of the Department of Defense or the U.S. Government].
AB - The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented. [The views expressed are those of the author and do not reflect the official policy or position of the Department of Defense or the U.S. Government].
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U2 - 10.1115/IPACK2011-52015
DO - 10.1115/IPACK2011-52015
M3 - Conference contribution
AN - SCOPUS:84860340330
SN - 9780791844618
T3 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
SP - 13
EP - 17
BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
T2 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Y2 - 6 July 2011 through 8 July 2011
ER -