TY - GEN
T1 - Design of piezoresistive silicon cantilevers with stress concentration region (SCR) for scanning probe microscopy (SPM) applications
AU - Gupta, A.
AU - Bashir, R.
AU - Neudeck, G. W.
AU - McElfresh, M.
PY - 2000
Y1 - 2000
N2 - This paper describes and evaluates the incorporation of novel Stress Concentration Region (SCR) in silicon based cantilevers to enhance piezoresistive displacement, force, and torque sensitivities. In brief, SCR is a region, on the cantilever, with a thickness smaller than the cantilever thickness and of an appropriate length to localize stress where piezoresistors are implanted. It was found that in order to improve the sensitivity the length, thickness and placement of the SCR on the cantilever have to be optimized. Performing the optimization can result in a 2X, 5X and 3X improvement in the piezoresistive displacement, force and torque sensitivity, respectively. ANSYS, a well-known Finite Element Analysis (FEA) software, was used to analyze and optimize the above stated parameters of the SCR.
AB - This paper describes and evaluates the incorporation of novel Stress Concentration Region (SCR) in silicon based cantilevers to enhance piezoresistive displacement, force, and torque sensitivities. In brief, SCR is a region, on the cantilever, with a thickness smaller than the cantilever thickness and of an appropriate length to localize stress where piezoresistors are implanted. It was found that in order to improve the sensitivity the length, thickness and placement of the SCR on the cantilever have to be optimized. Performing the optimization can result in a 2X, 5X and 3X improvement in the piezoresistive displacement, force and torque sensitivity, respectively. ANSYS, a well-known Finite Element Analysis (FEA) software, was used to analyze and optimize the above stated parameters of the SCR.
KW - Atomic Force Microscopy (AFM)
KW - Cantilever Design
KW - Finite Element Analysis (FEA)
KW - Piezoresistivity
KW - Sensitivity
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M3 - Conference contribution
AN - SCOPUS:6344283165
SN - 0966613570
SN - 9780966613575
T3 - 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
SP - 617
EP - 620
BT - 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
A2 - Laudon, M.
A2 - Romanowicz, B.
T2 - 2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
Y2 - 27 March 2000 through 29 March 2000
ER -