TY - GEN
T1 - Design, fabrication and heat transfer analysis of a mesoscopic pulse tube as an integrated micro-refrigeration system
AU - Shinde, Ninad
AU - Bashir, Rashid
AU - Groll, Eckhard
AU - Chiu, George
N1 - Publisher Copyright:
© 2000 by ASME.
PY - 2000
Y1 - 2000
N2 - The phenomenon of surface heat pumping has been widely used to accomplish refrigeration in macro-scale devices such as pulsetubes and thermo-acoustic devices. Pulse tube refrigerators are typically used to lift heat at cryogenic temperatures. The advantage of a pulse tube as a no moving part device makes it amenable to miniaturization at dimensional scales where areal effects, such as friction and viscosity, dominate. In this paper, the design and preliminary fabrication results of such a device to investigate the effect of surface heat pumping in mesoscopic glass channels are presented.
AB - The phenomenon of surface heat pumping has been widely used to accomplish refrigeration in macro-scale devices such as pulsetubes and thermo-acoustic devices. Pulse tube refrigerators are typically used to lift heat at cryogenic temperatures. The advantage of a pulse tube as a no moving part device makes it amenable to miniaturization at dimensional scales where areal effects, such as friction and viscosity, dominate. In this paper, the design and preliminary fabrication results of such a device to investigate the effect of surface heat pumping in mesoscopic glass channels are presented.
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U2 - 10.1115/IMECE2000-1451
DO - 10.1115/IMECE2000-1451
M3 - Conference contribution
AN - SCOPUS:85119833779
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 319
EP - 323
BT - Heat Transfer
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Y2 - 5 November 2000 through 10 November 2000
ER -