Dendritic materials as a dry release sacrificial layer

H. Suh, P. Bharathi, J. Moore, D. J. Beebe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a novel dry release process using a highly structured dendritic material as a sacrificial layer. A specific dendritic material under study, known as HB560, has been characterized and integrated into standard Microelectromechanical Systems processing. An array of electroplated nickel cantilever beams 100 μm×100 μm to approximately 1000 μm in length has been successfully fabricated and dry released. The required release time is 10 minutes at 650 °C in O2. A photosensitive version of the dendritic material has also been synthesized and characterized.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Editors Anon
PublisherIEEE
Pages200-204
Number of pages5
StatePublished - 1999
EventProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA
Duration: Jan 17 1999Jan 21 1999

Other

OtherProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS
CityOrlando, FL, USA
Period1/17/991/21/99

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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