Abstract
This paper presents a novel dry release process using a highly structured dendritic material as a sacrificial layer. A specific dendritic material under study, known as HB560, has been characterized and integrated into standard Microelectromechanical Systems processing. An array of electroplated nickel cantilever beams 100 μm×100 μm to approximately 1000 μm in length has been successfully fabricated and dry released. The required release time is 10 minutes at 650 °C in O2. A photosensitive version of the dendritic material has also been synthesized and characterized.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) |
| Editors | Anon |
| Publisher | IEEE |
| Pages | 200-204 |
| Number of pages | 5 |
| State | Published - 1999 |
| Event | Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA Duration: Jan 17 1999 → Jan 21 1999 |
Other
| Other | Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS |
|---|---|
| City | Orlando, FL, USA |
| Period | 1/17/99 → 1/21/99 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering