Dendritic material sacrificial layer micro-scale gap formation method

Hyuk-Jeen Suh; Pamidighantam Bharathi; Jeffrey S. Moore; David J Beebe

Dendritic material sacrificial layer micro-scale gap formation method

Hyuk-Jeen Suh (Inventor), Pamidighantam Bharathi (Inventor), Jeffrey S. Moore (Inventor), David J Beebe (Inventor)

Chemistry

Research output: Patent

Abstract

A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.

Original language	English (US)
U.S. patent number	6248668
Filing date	1/14/00
State	Published - Jun 19 2001

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title = "Dendritic material sacrificial layer micro-scale gap formation method",

abstract = "A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.",

author = "Hyuk-Jeen Suh and Pamidighantam Bharathi and Moore, {Jeffrey S.} and Beebe, {David J}",

note = "This invention was made with Government support under Grant No. 55-97-0126 awarded by the Army Research Office. The Government has certain rights in the invention.; 6248668",

year = "2001",

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day = "19",

language = "English (US)",

type = "Patent",

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T1 - Dendritic material sacrificial layer micro-scale gap formation method

AU - Suh, Hyuk-Jeen

AU - Bharathi, Pamidighantam

AU - Moore, Jeffrey S.

AU - Beebe, David J

N1 - This invention was made with Government support under Grant No. 55-97-0126 awarded by the Army Research Office. The Government has certain rights in the invention.

PY - 2001/6/19

Y1 - 2001/6/19

N2 - A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.

AB - A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.

M3 - Patent

M1 - 6248668

Y2 - 2000/01/14

ER -

Dendritic material sacrificial layer micro-scale gap formation method

Abstract

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