Dendritic material as a dry-release sacrificial layer

Hyuk Jeen Suh; Pamidighantam Bharathi; David J. Beebe; Jeffrey S. Moore

doi:10.1109/84.846700

Dendritic material as a dry-release sacrificial layer

Hyuk Jeen Suh, Pamidighantam Bharathi, David J. Beebe, Jeffrey S. Moore

Research output: Contribution to journal › Article › peer-review

Abstract

A dry-release process using highly structured dendritic material, specifically, hyperbranched polymers (HBP's), has been developed. A particular HBP under study, known as HB560, has been characterized and successfully integrated with microelectromechanical systems processing. An array of electroplated nickel cantilever beams 100 μm × 100 μm approx. 1000 μm in length has been successfully fabricated and dry released. The required release time is 10 min at 600°C in O₂. Single open-ended microchannels were fabricated to determine the etch time and tunneling length achieved using HB560 as a sacrificial material. The time improvement for the sacrificial release is on the order of 40× compared to standard HF wet-etch processes. Etch lengths of 1 cm have been successfully demonstrated with a sacrificial layer aspect ratio of 1600. A photosensitive version of the dendritic material has also been synthesized and characterized to reduce the process steps.

Original language	English (US)
Pages (from-to)	198-205
Number of pages	8
Journal	Journal of Microelectromechanical Systems
Volume	9
Issue number	2
DOIs	https://doi.org/10.1109/84.846700
State	Published - Jun 2000

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/84.846700

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title = "Dendritic material as a dry-release sacrificial layer",

abstract = "A dry-release process using highly structured dendritic material, specifically, hyperbranched polymers (HBP's), has been developed. A particular HBP under study, known as HB560, has been characterized and successfully integrated with microelectromechanical systems processing. An array of electroplated nickel cantilever beams 100 μm × 100 μm approx. 1000 μm in length has been successfully fabricated and dry released. The required release time is 10 min at 600°C in O2. Single open-ended microchannels were fabricated to determine the etch time and tunneling length achieved using HB560 as a sacrificial material. The time improvement for the sacrificial release is on the order of 40× compared to standard HF wet-etch processes. Etch lengths of 1 cm have been successfully demonstrated with a sacrificial layer aspect ratio of 1600. A photosensitive version of the dendritic material has also been synthesized and characterized to reduce the process steps.",

author = "Suh, {Hyuk Jeen} and Pamidighantam Bharathi and Beebe, {David J.} and Moore, {Jeffrey S.}",

note = "Funding Information: Manuscript received October 30, 1999; revised February 4, 2000. This work was supported by the Army Research Office Multidisciplinary Research Initiative under Grant DAAG55-97-0126. Subject Editor, R. T. Howe.",

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doi = "10.1109/84.846700",

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AU - Bharathi, Pamidighantam

AU - Beebe, David J.

AU - Moore, Jeffrey S.

N1 - Funding Information: Manuscript received October 30, 1999; revised February 4, 2000. This work was supported by the Army Research Office Multidisciplinary Research Initiative under Grant DAAG55-97-0126. Subject Editor, R. T. Howe.

PY - 2000/6

Y1 - 2000/6

N2 - A dry-release process using highly structured dendritic material, specifically, hyperbranched polymers (HBP's), has been developed. A particular HBP under study, known as HB560, has been characterized and successfully integrated with microelectromechanical systems processing. An array of electroplated nickel cantilever beams 100 μm × 100 μm approx. 1000 μm in length has been successfully fabricated and dry released. The required release time is 10 min at 600°C in O2. Single open-ended microchannels were fabricated to determine the etch time and tunneling length achieved using HB560 as a sacrificial material. The time improvement for the sacrificial release is on the order of 40× compared to standard HF wet-etch processes. Etch lengths of 1 cm have been successfully demonstrated with a sacrificial layer aspect ratio of 1600. A photosensitive version of the dendritic material has also been synthesized and characterized to reduce the process steps.

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Dendritic material as a dry-release sacrificial layer

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