Demonstration of self-aligned flip-chip photonic assembly with 1.1dB loss and > 120nm bandwidth

Tymon Barwicz, Yves Martin, Jae Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, Yurii A. Vlasov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We demonstrate direct flip-chip assembly of photonic dies with solder-induced selfalignment to sub-micron accuracy. We find a peak chip-to-chip transmission of -1.1 dB with 0.2 dB penalty over the 120 nm spectrum measured.

Original languageEnglish (US)
Title of host publicationFrontiers in Optics, FiO 2016
PublisherOSA - The Optical Society
ISBN (Print)9781943580194
DOIs
StatePublished - Jul 21 2014
EventFrontiers in Optics, FiO 2016 - Rochester, United States
Duration: Oct 17 2016Oct 21 2016

Publication series

NameOptics InfoBase Conference Papers

Conference

ConferenceFrontiers in Optics, FiO 2016
CountryUnited States
CityRochester
Period10/17/1610/21/16

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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    Barwicz, T., Martin, Y., Nah, J. W., Kamlapurkar, S., Bruce, R. L., Engelmann, S., & Vlasov, Y. A. (2014). Demonstration of self-aligned flip-chip photonic assembly with 1.1dB loss and > 120nm bandwidth. In Frontiers in Optics, FiO 2016 (Optics InfoBase Conference Papers). OSA - The Optical Society. https://doi.org/10.1364/FIO.2016.FF5F.3