Deformation of large micro-electromechanical systems (MEMS) due to thermal and intrinsic stresses

Muhammed T. Saif, Noel C. MacDonald

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a theoretical and experimental study of large micro mechanical cantilever beams fabricated by the SCREAM (single crystal reactive ion etching and metallization) process. SCREAM beams consist of an SCS core coated by films of SiO2 or nitride and metal. Thermal and intrinsic stresses develop in the beams due to the films and tend to deform them. Such deformations result in non-planar structures. For small micro mechanical systems, the non-planarity is negligible. When the structures' size is of the order of few millimeters, the non-planarity may limit the performance of the device. Here, we first treat the thermal and intrinsic strains of the films as material properties and measure them experimentally for PECVD SiO2. We then develop a simple model to predict the deformation of cantilever beams due to the thermal and intrinsic strains of SiO2 or nitride film. The model predicts that the non-planarity of the beam can be controlled by properly choosing the cross sectional dimension of the beam. We validate the theoretical prediction by fabricating cantilever beams which deform with negative, positive, and almost zero curvature.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages329-340
Number of pages12
ISBN (Print)0819417904
StatePublished - 1995
Externally publishedYes
EventSmart Structures and Materials 1995: Smart Materials - San Diego, CA, USA
Duration: Feb 27 1995Feb 28 1995

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume2441
ISSN (Print)0277-786X

Other

OtherSmart Structures and Materials 1995: Smart Materials
CitySan Diego, CA, USA
Period2/27/952/28/95

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Deformation of large micro-electromechanical systems (MEMS) due to thermal and intrinsic stresses'. Together they form a unique fingerprint.

Cite this