Defect inspection using a time-domain mode decomposition technique

Jinlong Zhu, Lynford L. Goddard

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we propose a technique called time-varying frequency scanning (TVFS) to meet the challenges in killer defect inspection. The proposed technique enables the dynamic monitoring of defects by checking the hopping in the instantaneous frequency data and the classification of defect types by comparing the difference in frequencies. The TVFS technique utilizes the bidimensional empirical mode decomposition (BEMD) method to separate the defect information from the sea of system errors. This significantly improve the signal-to-noise ratio (SNR) and moreover, it potentially enables reference-free defect inspection.

Original languageEnglish (US)
Title of host publicationMetrology, Inspection, and Process Control for Microlithography XXXII
EditorsVladimir A. Ukraintsev, Ofer Adan
PublisherSPIE
ISBN (Electronic)9781510616622
DOIs
StatePublished - Jan 1 2018
EventMetrology, Inspection, and Process Control for Microlithography XXXII 2018 - San Jose, United States
Duration: Feb 26 2018Mar 1 2018

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10585
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherMetrology, Inspection, and Process Control for Microlithography XXXII 2018
CountryUnited States
CitySan Jose
Period2/26/183/1/18

Fingerprint

Defect Inspection
Decomposition Techniques
Time Domain
inspection
Defects
Inspection
Decomposition
decomposition
Scanning
Time-varying
defects
frequency scanning
Instantaneous Frequency
Decomposition Method
Monitoring
Signal to noise ratio
signal to noise ratios

Keywords

  • Defect inspection
  • empirical mode decomposition
  • time-varying frequency scanning

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Zhu, J., & Goddard, L. L. (2018). Defect inspection using a time-domain mode decomposition technique. In V. A. Ukraintsev, & O. Adan (Eds.), Metrology, Inspection, and Process Control for Microlithography XXXII [1058508] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10585). SPIE. https://doi.org/10.1117/12.2297443

Defect inspection using a time-domain mode decomposition technique. / Zhu, Jinlong; Goddard, Lynford L.

Metrology, Inspection, and Process Control for Microlithography XXXII. ed. / Vladimir A. Ukraintsev; Ofer Adan. SPIE, 2018. 1058508 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10585).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhu, J & Goddard, LL 2018, Defect inspection using a time-domain mode decomposition technique. in VA Ukraintsev & O Adan (eds), Metrology, Inspection, and Process Control for Microlithography XXXII., 1058508, Proceedings of SPIE - The International Society for Optical Engineering, vol. 10585, SPIE, Metrology, Inspection, and Process Control for Microlithography XXXII 2018, San Jose, United States, 2/26/18. https://doi.org/10.1117/12.2297443
Zhu J, Goddard LL. Defect inspection using a time-domain mode decomposition technique. In Ukraintsev VA, Adan O, editors, Metrology, Inspection, and Process Control for Microlithography XXXII. SPIE. 2018. 1058508. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.2297443
Zhu, Jinlong ; Goddard, Lynford L. / Defect inspection using a time-domain mode decomposition technique. Metrology, Inspection, and Process Control for Microlithography XXXII. editor / Vladimir A. Ukraintsev ; Ofer Adan. SPIE, 2018. (Proceedings of SPIE - The International Society for Optical Engineering).
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