@inproceedings{e41c531e0b2a47708e530439c7f1c732,
title = "Defect inspection using a time-domain mode decomposition technique",
abstract = "In this paper, we propose a technique called time-varying frequency scanning (TVFS) to meet the challenges in killer defect inspection. The proposed technique enables the dynamic monitoring of defects by checking the hopping in the instantaneous frequency data and the classification of defect types by comparing the difference in frequencies. The TVFS technique utilizes the bidimensional empirical mode decomposition (BEMD) method to separate the defect information from the sea of system errors. This significantly improve the signal-to-noise ratio (SNR) and moreover, it potentially enables reference-free defect inspection.",
keywords = "Defect inspection, empirical mode decomposition, time-varying frequency scanning",
author = "Jinlong Zhu and Goddard, {Lynford L.}",
note = "Publisher Copyright: {\textcopyright} 2018 SPIE.; Metrology, Inspection, and Process Control for Microlithography XXXII 2018 ; Conference date: 26-02-2018 Through 01-03-2018",
year = "2018",
doi = "10.1117/12.2297443",
language = "English (US)",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Ukraintsev, {Vladimir A.} and Ofer Adan",
booktitle = "Metrology, Inspection, and Process Control for Microlithography XXXII",
}