Dc magnetron reactive sputtering of low stress ain piezoelectric thin films for mems application

Keyphrases

• Low Stress 100%
• Deposition Parameters 100%
• Piezoelectric Thin Film 100%
• Ultrasonic Resonator 100%
• Magnetron Reactive Sputtering 100%
• Low Temperature 50%
• Coupling Constant 50%
• Photolithographic 50%
• Film Deposition 50%
• Silicon Substrate 50%
• Diffraction 50%
• Piezoelectric Coefficient 50%
• Device Performance 50%
• Spectroscopic Ellipsometry 50%
• Film Stress 50%
• Chemical Detection 50%
• Nitrides 50%
• Electromechanical Coupling 50%
• Stress Control 50%
• MEMS Devices 50%
• Foundry 50%
• Film Properties 50%
• Sensing Device 50%
• Silicon Integrated Circuits 50%
• Sensor Performance 50%
• Surface Profilometry 50%
• Silicon Membrane 50%
• Device Yield 50%
• Mechanical Structure 50%
• Impurity Contamination 50%
• Film Uniformity 50%
• Film Characterization 50%
• Central Composite Design 50%
• Piezoelectric Excitation 50%
• Device Miniaturization 50%
• Gravimetric Sensing 50%
• MEMS Fabrication 50%

Engineering

• Microelectromechanical System 100%
• Thin Films 100%
• Piezoelectric 100%
• Magnetron 100%
• Reactive Sputtering 100%
• Mem Application 100%
• Resonator 66%
• Ultrasonics 66%
• Deposition Parameter 66%
• Low-Temperature 33%
• Ray Diffraction 33%
• Silicon Substrate 33%
• Nitride 33%
• Piezoelectric Coefficient 33%
• Device Performance 33%
• Maximization 33%
• Film Property 33%
• Sensing Device 33%
• Mechanical Structure 33%
• Film Uniformity 33%
• Central Composite Design 33%
• Design Set 33%
• Integrated Circuit 33%

Material Science

• Microelectromechanical System 100%
• Silicon 100%
• Thin Films 100%
• Film 100%
• Piezoelectricity 100%
• Resonator 66%
• Electronic Circuit 33%
• Coupling Constant 33%
• Film Deposition 33%
• Aluminum Nitride 33%
• Electromechanical Coupling 33%
• Composite Material 33%
• Surface (Surface Science) 33%