DC and AC electrothermal charicterization of heated microcantilevers using scanning thermoreflectance microscopy

Joohyun Kim, Sunwoo Han, Keunhan Park, Bong Jae Lee, William Paul King, Jungchul Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report the application of scanning thermoreflectance microscopy for steady - as well as periodic-temperature calibration of a microheater-integrated atomic force microscope cantilever (or heated microcantilever). While the heated microcantilever was operated with either DC or AC powers, local thermoreflectance signals were measured using a home-built scanning thermoreflectance microscope and converted into local temperatures using a calibration with Raman thermometry. For our scanning thermoreflectance microscopy, temporal resolution of 10 μs and spatial resolution of 2 μm were achieved. The shrinkage of the AC temperature oscillation amplitude was observed as the modulation frequency increased and thermal cut-off frequency near 1 kHz was found. In addition, strong thickness-dependent thermoreflectance signals were experimentally confirmed and might be useful for noncontact thickness measurements of free standing microelectromechanical systems devices having uniform temperatures.

Original languageEnglish (US)
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages409-412
Number of pages4
DOIs
StatePublished - 2013
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
Duration: Jan 20 2013Jan 24 2013

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Country/TerritoryTaiwan, Province of China
CityTaipei
Period1/20/131/24/13

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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