Damage accumulation in Si during high-dose self-ion implantation

Y. Zhong, C. Bailat, R. S. Averback, S. K. Ghose, I. K. Robinson

Research output: Contribution to journalArticlepeer-review

Abstract

The damage accumulation in Si during high-dose self-ion implantation was investigated by x-ray scattering and TEM. It was found that small vacancy and interstitial clusters formed during implantation, whose concentrations saturated after a dose of ≊ 3×10 14 cm ∓2. It was found that the concentration of implanted Si atoms became comparable to the saturation concentration of Frenkel pairs at a dose of ≊1×10 15 cm ∓2. The annealing behaviour was also found to reflect the initial state of damage within the implanted silicon samples.

Original languageEnglish (US)
Pages (from-to)1328-1335
Number of pages8
JournalJournal of Applied Physics
Volume96
Issue number3
DOIs
StatePublished - Aug 1 2004

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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