Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Qiu Lian Zeng, Zhong Guang Wang, A. I.Ping Xian, J. K. Shang

Research output: Contribution to journalArticle

Abstract

Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the micro-cracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior was shown to result from accumulation of microcrack density with fatigue cycles.

Original languageEnglish (US)
Pages (from-to)62-67
Number of pages6
JournalJournal of Electronic Materials
Volume34
Issue number1
DOIs
StatePublished - Jan 2005

Keywords

  • Cyclic softening
  • Lead-free solder
  • Low-cycle fatigue
  • Sn-3.8Ag-0.7Cu alloy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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