Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Qiu Lian Zeng; Zhong Guang Wang; A. I.Ping Xian; J. K. Shang

doi:10.1007/s11664-005-0181-7

Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Qiu Lian Zeng, Zhong Guang Wang, A. I.Ping Xian, J. K. Shang

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the micro-cracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior was shown to result from accumulation of microcrack density with fatigue cycles.

Original language	English (US)
Pages (from-to)	62-67
Number of pages	6
Journal	Journal of Electronic Materials
Volume	34
Issue number	1
DOIs	https://doi.org/10.1007/s11664-005-0181-7
State	Published - Jan 2005

Keywords

Cyclic softening
Lead-free solder
Low-cycle fatigue
Sn-3.8Ag-0.7Cu alloy

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Online availability

10.1007/s11664-005-0181-7

Library availability

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title = "Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure",

abstract = "Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the micro-cracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior was shown to result from accumulation of microcrack density with fatigue cycles.",

keywords = "Cyclic softening, Lead-free solder, Low-cycle fatigue, Sn-3.8Ag-0.7Cu alloy",

author = "Zeng, {Qiu Lian} and Wang, {Zhong Guang} and Xian, {A. I.Ping} and Shang, {J. K.}",

note = "Funding Information: Support for this work was provided by the Natural Science Foundation of China through Grant No. 50228101.",

year = "2005",

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T1 - Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

AU - Zeng, Qiu Lian

AU - Wang, Zhong Guang

AU - Xian, A. I.Ping

AU - Shang, J. K.

N1 - Funding Information: Support for this work was provided by the Natural Science Foundation of China through Grant No. 50228101.

PY - 2005/1

Y1 - 2005/1

N2 - Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the micro-cracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior was shown to result from accumulation of microcrack density with fatigue cycles.

AB - Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the micro-cracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior was shown to result from accumulation of microcrack density with fatigue cycles.

KW - Cyclic softening

KW - Lead-free solder

KW - Low-cycle fatigue

KW - Sn-3.8Ag-0.7Cu alloy

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Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Abstract

Keywords

ASJC Scopus subject areas

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