Custom test chip for system-level ESD investinvestigations

Nicholas Thomson, Yang Xiu, Robert Mertens, Min Sun Keel, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.

Original languageEnglish (US)
Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2014
PublisherESD Association
EditionNovember
ISBN (Electronic)1585372587, 9781585372577
StatePublished - Nov 26 2014
Event36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014 - Tucson, United States
Duration: Sep 7 2014Sep 12 2014

Publication series

NameElectrical Overstress/Electrostatic Discharge Symposium Proceedings
NumberNovember
Volume2014-November
ISSN (Print)0739-5159

Other

Other36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014
Country/TerritoryUnited States
CityTucson
Period9/7/149/12/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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