Custom test chip for system-level ESD investinvestigations

Nicholas Thomson; Yang Xiu; Robert Mertens; Min Sun Keel; Elyse Rosenbaum

Custom test chip for system-level ESD investinvestigations

Nicholas Thomson, Yang Xiu, Robert Mertens, Min Sun Keel, Elyse Rosenbaum

Research output: Contribution to journal › Conference article › peer-review

Abstract

A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.

Original language	English (US)
Journal	Electrical Overstress/Electrostatic Discharge Symposium Proceedings
Volume	2014-November
Issue number	November
State	Published - Nov 26 2014
Event	36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014 - Tucson, United States Duration: Sep 7 2014 → Sep 12 2014

ASJC Scopus subject areas

Electrical and Electronic Engineering

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title = "Custom test chip for system-level ESD investinvestigations",

abstract = "A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.",

author = "Nicholas Thomson and Yang Xiu and Robert Mertens and Keel, {Min Sun} and Elyse Rosenbaum",

year = "2014",

month = nov,

day = "26",

language = "English (US)",

volume = "2014-November",

journal = "Electrical Overstress/Electrostatic Discharge Symposium Proceedings",

issn = "0739-5159",

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note = "36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014 ; Conference date: 07-09-2014 Through 12-09-2014",

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T1 - Custom test chip for system-level ESD investinvestigations

AU - Thomson, Nicholas

AU - Xiu, Yang

AU - Mertens, Robert

AU - Keel, Min Sun

AU - Rosenbaum, Elyse

PY - 2014/11/26

Y1 - 2014/11/26

N2 - A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.

AB - A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.

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M3 - Conference article

AN - SCOPUS:84938149130

SN - 0739-5159

VL - 2014-November

JO - Electrical Overstress/Electrostatic Discharge Symposium Proceedings

JF - Electrical Overstress/Electrostatic Discharge Symposium Proceedings

IS - November

T2 - 36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014

Y2 - 7 September 2014 through 12 September 2014

ER -

Custom test chip for system-level ESD investinvestigations

Abstract

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