A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.
|Original language||English (US)|
|Journal||Electrical Overstress/Electrostatic Discharge Symposium Proceedings|
|State||Published - Nov 26 2014|
|Event||36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014 - Tucson, United States|
Duration: Sep 7 2014 → Sep 12 2014
ASJC Scopus subject areas
- Electrical and Electronic Engineering