Custom test chip for system-level ESD investinvestigations

Nicholas Thomson, Yang Xiu, Robert Mertens, Min Sun Keel, Elyse Rosenbaum

Research output: Contribution to journalConference article

Abstract

A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system Iddq monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.

Original languageEnglish (US)
JournalElectrical Overstress/Electrostatic Discharge Symposium Proceedings
Volume2014-November
Issue numberNovember
StatePublished - Nov 26 2014
Event36th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2014 - Tucson, United States
Duration: Sep 7 2014Sep 12 2014

Fingerprint

Logic circuits
Transmitters
Detectors
Monitoring
Testing
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Custom test chip for system-level ESD investinvestigations. / Thomson, Nicholas; Xiu, Yang; Mertens, Robert; Keel, Min Sun; Rosenbaum, Elyse.

In: Electrical Overstress/Electrostatic Discharge Symposium Proceedings, Vol. 2014-November, No. November, 26.11.2014.

Research output: Contribution to journalConference article

Thomson, Nicholas ; Xiu, Yang ; Mertens, Robert ; Keel, Min Sun ; Rosenbaum, Elyse. / Custom test chip for system-level ESD investinvestigations. In: Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 2014 ; Vol. 2014-November, No. November.
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