Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

L. Zhang, Z. G. Wang, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

Weakening of Pb-free solder joints by high-density electric currents was investigated by combining electromigration experiments with micromechanical testing. Prolonged exposure of the Sn3.5Ag0.7Cu/Cu interconnects to electric currents resulted in hillock formation on the sample surface. After electromigration, the strength of the solder joint was reduced by nearly half. However, the strength loss was recoverable by thermal annealing of the electromigration damage.

Original languageEnglish (US)
Pages (from-to)381-384
Number of pages4
JournalScripta Materialia
Volume56
Issue number5
DOIs
StatePublished - Mar 1 2007

Keywords

  • Electromigration
  • Pb-free solder
  • Solder joint
  • Strength

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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