Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

L. Zhang; Z. G. Wang; J. K. Shang

doi:10.1016/j.scriptamat.2006.10.043

Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

L. Zhang, Z. G. Wang, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

Weakening of Pb-free solder joints by high-density electric currents was investigated by combining electromigration experiments with micromechanical testing. Prolonged exposure of the Sn3.5Ag0.7Cu/Cu interconnects to electric currents resulted in hillock formation on the sample surface. After electromigration, the strength of the solder joint was reduced by nearly half. However, the strength loss was recoverable by thermal annealing of the electromigration damage.

Original language	English (US)
Pages (from-to)	381-384
Number of pages	4
Journal	Scripta Materialia
Volume	56
Issue number	5
DOIs	https://doi.org/10.1016/j.scriptamat.2006.10.043
State	Published - Mar 2007
Externally published	Yes

Keywords

Electromigration
Pb-free solder
Solder joint
Strength

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Online availability

10.1016/j.scriptamat.2006.10.043

Library availability

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title = "Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints",

abstract = "Weakening of Pb-free solder joints by high-density electric currents was investigated by combining electromigration experiments with micromechanical testing. Prolonged exposure of the Sn3.5Ag0.7Cu/Cu interconnects to electric currents resulted in hillock formation on the sample surface. After electromigration, the strength of the solder joint was reduced by nearly half. However, the strength loss was recoverable by thermal annealing of the electromigration damage.",

keywords = "Electromigration, Pb-free solder, Solder joint, Strength",

author = "L. Zhang and Wang, {Z. G.} and Shang, {J. K.}",

note = "Funding Information: Support for this study was provided by the Chinese Natural Science Foundation under Grant no. 50228101 and the National Basic Research Program of China, no. 2004CB619306. ",

year = "2007",

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doi = "10.1016/j.scriptamat.2006.10.043",

language = "English (US)",

volume = "56",

pages = "381--384",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

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TY - JOUR

T1 - Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

AU - Zhang, L.

AU - Wang, Z. G.

AU - Shang, J. K.

N1 - Funding Information: Support for this study was provided by the Chinese Natural Science Foundation under Grant no. 50228101 and the National Basic Research Program of China, no. 2004CB619306.

PY - 2007/3

Y1 - 2007/3

N2 - Weakening of Pb-free solder joints by high-density electric currents was investigated by combining electromigration experiments with micromechanical testing. Prolonged exposure of the Sn3.5Ag0.7Cu/Cu interconnects to electric currents resulted in hillock formation on the sample surface. After electromigration, the strength of the solder joint was reduced by nearly half. However, the strength loss was recoverable by thermal annealing of the electromigration damage.

AB - Weakening of Pb-free solder joints by high-density electric currents was investigated by combining electromigration experiments with micromechanical testing. Prolonged exposure of the Sn3.5Ag0.7Cu/Cu interconnects to electric currents resulted in hillock formation on the sample surface. After electromigration, the strength of the solder joint was reduced by nearly half. However, the strength loss was recoverable by thermal annealing of the electromigration damage.

KW - Electromigration

KW - Pb-free solder

KW - Solder joint

KW - Strength

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DO - 10.1016/j.scriptamat.2006.10.043

M3 - Article

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SN - 1359-6462

VL - 56

SP - 381

EP - 384

JO - Scripta Materialia

JF - Scripta Materialia

IS - 5

ER -

Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

Abstract

Keywords

ASJC Scopus subject areas

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