TY - GEN
T1 - Current challenges in component-level and system-level ESD simulation
AU - Rosenbaum, Elyse
AU - Meng, Kuo Hsuan
AU - Xiu, Yang
AU - Thomson, Nicholas
N1 - Funding Information:
ACKNOWLEDGEMENT This work is partly supported by Semiconductor Research Corporation (SRC) task #1836.141 through The University of Texas at Dallas? Texas Analog Center of Excellence (TxACE).
Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/3
Y1 - 2015/8/3
N2 - Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.
AB - Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.
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U2 - 10.1109/APEMC.2015.7175328
DO - 10.1109/APEMC.2015.7175328
M3 - Conference contribution
AN - SCOPUS:84964045854
T3 - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
SP - 333
EP - 336
BT - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
Y2 - 25 May 2015 through 29 May 2015
ER -