Abstract
Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.
| Original language | English (US) |
|---|---|
| Title of host publication | 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 333-336 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781479966707 |
| DOIs | |
| State | Published - Aug 3 2015 |
| Event | Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 - Taipei, Taiwan, Province of China Duration: May 25 2015 → May 29 2015 |
Publication series
| Name | 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 |
|---|
Other
| Other | Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 |
|---|---|
| Country | Taiwan, Province of China |
| City | Taipei |
| Period | 5/25/15 → 5/29/15 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Radiation
Cite this
Current challenges in component-level and system-level ESD simulation. / Rosenbaum, Elyse; Meng, Kuo Hsuan; Xiu, Yang; Thomson, Nicholas.
2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 333-336 7175328 (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Current challenges in component-level and system-level ESD simulation
AU - Rosenbaum, Elyse
AU - Meng, Kuo Hsuan
AU - Xiu, Yang
AU - Thomson, Nicholas
PY - 2015/8/3
Y1 - 2015/8/3
N2 - Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.
AB - Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.
UR - http://www.scopus.com/inward/record.url?scp=84964045854&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84964045854&partnerID=8YFLogxK
U2 - 10.1109/APEMC.2015.7175328
DO - 10.1109/APEMC.2015.7175328
M3 - Conference contribution
AN - SCOPUS:84964045854
T3 - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
SP - 333
EP - 336
BT - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
ER -