Current challenges in component-level and system-level ESD simulation

Elyse Rosenbaum, Kuo Hsuan Meng, Yang Xiu, Nicholas Thomson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.

Original languageEnglish (US)
Title of host publication2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages333-336
Number of pages4
ISBN (Electronic)9781479966707
DOIs
StatePublished - Aug 3 2015
EventAsia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 - Taipei, Taiwan, Province of China
Duration: May 25 2015May 29 2015

Publication series

Name2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015

Other

OtherAsia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
CountryTaiwan, Province of China
CityTaipei
Period5/25/155/29/15

Fingerprint

beds
Computational efficiency
simulation
test stands
qualifications
manufacturing
electronics

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Radiation

Cite this

Rosenbaum, E., Meng, K. H., Xiu, Y., & Thomson, N. (2015). Current challenges in component-level and system-level ESD simulation. In 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 (pp. 333-336). [7175328] (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEMC.2015.7175328

Current challenges in component-level and system-level ESD simulation. / Rosenbaum, Elyse; Meng, Kuo Hsuan; Xiu, Yang; Thomson, Nicholas.

2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 333-336 7175328 (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rosenbaum, E, Meng, KH, Xiu, Y & Thomson, N 2015, Current challenges in component-level and system-level ESD simulation. in 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015., 7175328, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015, Institute of Electrical and Electronics Engineers Inc., pp. 333-336, Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015, Taipei, Taiwan, Province of China, 5/25/15. https://doi.org/10.1109/APEMC.2015.7175328
Rosenbaum E, Meng KH, Xiu Y, Thomson N. Current challenges in component-level and system-level ESD simulation. In 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 333-336. 7175328. (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015). https://doi.org/10.1109/APEMC.2015.7175328
Rosenbaum, Elyse ; Meng, Kuo Hsuan ; Xiu, Yang ; Thomson, Nicholas. / Current challenges in component-level and system-level ESD simulation. 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 333-336 (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015).
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