@inproceedings{0faa6293abb749f38574b2ebf422e006,
title = "Current challenges in component-level and system-level ESD simulation",
abstract = "Electronic systems and components contain large numbers of elements and have a complex non-linear response to ESD; thus, passing ESD qualification on the first pass is unlikely to occur unless the robustness is verified by means of simulation prior to manufacturing. For component-level ESD verification, the primary challenge is in regards to computational efficiency; for system-level ESD verification, component and test bed modeling present major challenges.",
author = "Elyse Rosenbaum and Meng, {Kuo Hsuan} and Yang Xiu and Nicholas Thomson",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 ; Conference date: 25-05-2015 Through 29-05-2015",
year = "2015",
month = aug,
day = "3",
doi = "10.1109/APEMC.2015.7175328",
language = "English (US)",
series = "2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "333--336",
booktitle = "2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015",
address = "United States",
}