Cu Nanospring Films for Advanced Nanothermal Interfaces

Keyphrases

• Nanosprings 100%
• Nanothermal 100%
• Elastic Modulus 66%
• Thermal Conductivity 33%
• High Thermal Conductivity 33%
• Thermal Properties 33%
• Mechanical Properties 33%
• Thermal Interface Materials 33%
• Lateral Stability 33%
• Thermal Resistance 33%
• Shear Compliance 33%
• Soft Polymer 33%
• Normal Compliance 33%
• Material Selection Charts 33%

Material Science

• Thermal Conductivity 100%
• Elastic Moduli 100%
• Film 50%
• Interface (Material) 50%
• Thermal Property 50%
• Heat Resistance 50%
• Material Selection Chart 50%

Engineering

• Modulus of Elasticity 100%
• Thermal Conductivity 50%
• High Thermal Conductivity 50%
• Material Interface 50%
• Empty Space 50%
• Heat Resistance 50%
• Lateral Stability 50%