Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis; Ryan N. Mott; Debashish Das; David Shaddock; Ioannis Chasiotis

doi:10.1002/adem.201700910

Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis, Ryan N. Mott, Debashish Das, David Shaddock, Ioannis Chasiotis

Research output: Contribution to journal › Article › peer-review

Abstract

An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm²KW⁻¹ is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

Original language	English (US)
Article number	1700910
Journal	Advanced Engineering Materials
Volume	20
Issue number	3
DOIs	https://doi.org/10.1002/adem.201700910
State	Published - Mar 2018

Keywords

Compliant films
Glancing angle deposition
Thermal conductivity
Thermal mismatch
Toughness

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics

Online availability

10.1002/adem.201700910

Library availability

Discover UIUC Full Text

Cite this

@article{3036492beb554ad3a56715b3b33687df,

title = "Cu Nanospring Films for Advanced Nanothermal Interfaces",

abstract = "An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.",

keywords = "Compliant films, Glancing angle deposition, Thermal conductivity, Thermal mismatch, Toughness",

author = "Antartis, {Dimitrios A.} and Mott, {Ryan N.} and Debashish Das and David Shaddock and Ioannis Chasiotis",

note = "The authors acknowledge the support by the Air Force Office of Scientific Research (AFOSR) through grants FA9550-13-1-0149 and FA9550-15-1-0470 with Dr. B. L. Lee as the program manager, and DARPA Contract N66001-09-C-2014. The authors also thank Prof. M. Brett from the University of Alberta for his input on the fabrication of the GLAD films and Prof. J. R. Abelson from the University of Illinois for his help with the materials selection chart. The views, opinions, and/or findings expressed are those of the authors and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government.",

year = "2018",

month = mar,

doi = "10.1002/adem.201700910",

language = "English (US)",

volume = "20",

journal = "Advanced Engineering Materials",

issn = "1438-1656",

publisher = "Wiley-VCH",

number = "3",

}

TY - JOUR

T1 - Cu Nanospring Films for Advanced Nanothermal Interfaces

AU - Antartis, Dimitrios A.

AU - Mott, Ryan N.

AU - Das, Debashish

AU - Shaddock, David

AU - Chasiotis, Ioannis

N1 - The authors acknowledge the support by the Air Force Office of Scientific Research (AFOSR) through grants FA9550-13-1-0149 and FA9550-15-1-0470 with Dr. B. L. Lee as the program manager, and DARPA Contract N66001-09-C-2014. The authors also thank Prof. M. Brett from the University of Alberta for his input on the fabrication of the GLAD films and Prof. J. R. Abelson from the University of Illinois for his help with the materials selection chart. The views, opinions, and/or findings expressed are those of the authors and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government.

PY - 2018/3

Y1 - 2018/3

N2 - An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

AB - An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

KW - Compliant films

KW - Glancing angle deposition

KW - Thermal conductivity

KW - Thermal mismatch

KW - Toughness

UR - http://www.scopus.com/inward/record.url?scp=85040780717&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85040780717&partnerID=8YFLogxK

U2 - 10.1002/adem.201700910

DO - 10.1002/adem.201700910

M3 - Article

AN - SCOPUS:85040780717

SN - 1438-1656

VL - 20

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

IS - 3

M1 - 1700910

ER -

Cu Nanospring Films for Advanced Nanothermal Interfaces

Abstract

Keywords

ASJC Scopus subject areas

Online availability

Library availability

Related links

Fingerprint

Cite this