Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis, Ryan N. Mott, Debashish Das, David Shaddock, Ioannis Chasiotis

Research output: Contribution to journalArticlepeer-review


An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

Original languageEnglish (US)
Article number1700910
JournalAdvanced Engineering Materials
Issue number3
StatePublished - Mar 2018


  • Compliant films
  • Glancing angle deposition
  • Thermal conductivity
  • Thermal mismatch
  • Toughness

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics


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