Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis; Ryan N. Mott; Debashish Das; David Shaddock; Ioannis Chasiotis

doi:10.1002/adem.201700910

Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis, Ryan N. Mott, Debashish Das, David Shaddock, Ioannis Chasiotis

Research output: Contribution to journal › Article

Abstract

An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm²KW⁻¹ is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

Original language	English (US)
Article number	1700910
Journal	Advanced Engineering Materials
Volume	20
Issue number	3
DOIs	https://doi.org/10.1002/adem.201700910
State	Published - Mar 2018

Keywords

Compliant films
Glancing angle deposition
Thermal conductivity
Thermal mismatch
Toughness

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

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10.1002/adem.201700910

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Antartis, D. A., Mott, R. N., Das, D., Shaddock, D., & Chasiotis, I. (2018). Cu Nanospring Films for Advanced Nanothermal Interfaces. Advanced Engineering Materials, 20(3), [1700910]. https://doi.org/10.1002/adem.201700910

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AB - An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

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KW - Toughness

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