Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis; Ryan N. Mott; Debashish Das; David Shaddock; Ioannis Chasiotis

doi:10.1002/adem.201700910

Cu Nanospring Films for Advanced Nanothermal Interfaces

Dimitrios A. Antartis, Ryan N. Mott, Debashish Das, David Shaddock, Ioannis Chasiotis

Research output: Contribution to journal › Article › peer-review

Abstract

An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm²KW⁻¹ is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

Original language	English (US)
Article number	1700910
Journal	Advanced Engineering Materials
Volume	20
Issue number	3
DOIs	https://doi.org/10.1002/adem.201700910
State	Published - Mar 2018

Keywords

Compliant films
Glancing angle deposition
Thermal conductivity
Thermal mismatch
Toughness

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics

Online availability

10.1002/adem.201700910

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title = "Cu Nanospring Films for Advanced Nanothermal Interfaces",

abstract = "An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.",

keywords = "Compliant films, Glancing angle deposition, Thermal conductivity, Thermal mismatch, Toughness",

author = "Antartis, {Dimitrios A.} and Mott, {Ryan N.} and Debashish Das and David Shaddock and Ioannis Chasiotis",

note = "Publisher Copyright: {\textcopyright} 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim",

year = "2018",

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doi = "10.1002/adem.201700910",

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AU - Antartis, Dimitrios A.

AU - Mott, Ryan N.

AU - Das, Debashish

AU - Shaddock, David

AU - Chasiotis, Ioannis

PY - 2018/3

Y1 - 2018/3

N2 - An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

AB - An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.

KW - Compliant films

KW - Glancing angle deposition

KW - Thermal conductivity

KW - Thermal mismatch

KW - Toughness

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ER -

Cu Nanospring Films for Advanced Nanothermal Interfaces

Abstract

Keywords

ASJC Scopus subject areas

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