@article{3036492beb554ad3a56715b3b33687df,
title = "Cu Nanospring Films for Advanced Nanothermal Interfaces",
abstract = "An advanced thermal interface material comprised of dense and orderly arrays of 10-µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.",
keywords = "Compliant films, Glancing angle deposition, Thermal conductivity, Thermal mismatch, Toughness",
author = "Antartis, {Dimitrios A.} and Mott, {Ryan N.} and Debashish Das and David Shaddock and Ioannis Chasiotis",
note = "Funding Information: The authors acknowledge the support by the Air Force Office of Scientific Research (AFOSR) through grants FA9550-13-1-0149 and FA9550-15-1-0470 with Dr. B. L. Lee as the program manager, and DARPA Contract N66001-09-C-2014. The authors also thank Prof. M. Brett from the University of Alberta for his input on the fabrication of the GLAD films and Prof. J. R. Abelson from the University of Illinois for his help with the materials selection chart. The views, opinions, and/or findings expressed are those of the authors and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government. Publisher Copyright: {\textcopyright} 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim",
year = "2018",
month = mar,
doi = "10.1002/adem.201700910",
language = "English (US)",
volume = "20",
journal = "Advanced Engineering Materials",
issn = "1438-1656",
publisher = "Wiley-VCH",
number = "3",
}