Cross-layer resilience in low-voltage digital systems: Key insights

Eric Cheng, Jacob Abraham, Pradip Bose, Alper Buyuktosunoglu, Keith Campbell, Deming Chen, Cheng Yong Cher, Hyungmin Cho, Binh Le, Klas Lilja, Shahrzad Mirkhani, Kevin Skadron, Mircea Stan, Lukasz Szafaryn, Christos Vezyrtzis, Subhasish Mitra

Electrical and Computer Engineering
Coordinated Science Lab
Information Trust Institute
Siebel School of Computing and Data Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Cross-layer resilience in low-voltage digital systems: Key insights

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Computer Science