Cross comparison of direct strength testing techniques on polysilicon films

David A. LaVan, Toshiyuki Tsuchiya, George Coles, Wolfgang G. Knauss, Ioannis Chasiotis, David Read

Research output: Contribution to journalConference articlepeer-review


Several direct and indirect testing techniques to characterize the strength and distribution in strength of structural thin films have been developed with widely varying results appearing in the literature (roughly 1 to 4 GPa for polysilicon). Much of the variation between authors has been explained in terms of microstructural differences, sample size effects, and release techniques. Five laboratories participated in a cross comparison of direct tensile testing techniques in an effort to study these variations; all samples were fabricated and released simultaneously at Sandia National Labs to eliminate material variations. Sample lengths ranged from 15 to 1000 μm long. All the samples were fabricated with a thickness of 2.5 μm. The distributions in strength are reported along with a tabulation of mean, standard deviation, and Weibull modulus of fracture strength for each lab.

Original languageEnglish (US)
Pages (from-to)16-27
Number of pages12
JournalASTM Special Technical Publication
Issue number1413
StatePublished - 2001
Externally publishedYes
EventMechanical Properties of Structural Films - Orlando, FL, United States
Duration: Nov 15 2000Nov 16 2000


  • Distribution
  • Fracture
  • MEMS
  • Polysilicon
  • Strength
  • Tensile
  • Testing
  • Thin film

ASJC Scopus subject areas

  • General Engineering


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