Skip to main navigation
Skip to search
Skip to main content
University of Illinois Urbana-Champaign Home
LOGIN & Help
Home
Profiles
Research units
Research & Scholarship
Datasets
Honors
Press/Media
Activities
Search by expertise, name or affiliation
Creep rupture of Sn-Ag-Cu Pb-free solder alloy
L. Zhang, Z. G. Wang, J. K. Shang
Research output
:
Contribution to journal
›
Article
›
peer-review
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Creep rupture of Sn-Ag-Cu Pb-free solder alloy'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Engineering
Creep
100%
Eutectics
100%
Free Solder
100%
Creep Rupture
100%
Creep Test
50%
Isothermal Condition
50%
Material Parameter
50%
Electronic Packaging
50%
Temperature Time
50%
Temperature Equation
50%
Creep Lifetime
50%
Creep Rupture Data
50%
Keyphrases
Pb-free Solder
100%
Sn-Ag-Cu
100%
Creep Rupture
100%
Creep Deformation
50%
Solder Alloys
50%
Creep Test
25%
Miller
25%
Isothermal Condition
25%
Material Parameters
25%
Electronic Packaging
25%
Creep Rupture Behavior
25%
Temperature Equation
25%
Lifetime Data
25%
Time-temperature Combination
25%
Sn-Ag-Cu Solder
25%
Pb-free
25%
Creep Lifetime
25%
Pb-Sn Solder
25%
Free Replacement
25%
Material Science
Creep
100%
Lead-Free Solder
100%