Abstract
The eutectic Sn3.8Ag0.7Cu alloy is widely considered a leading Pb-free replacement for the eutectic Pb-Sn solder alloy in electronic packaging where creep deformation and rupture is a major concern. In this study, creep rupture behavior of Sn-Ag-Cu solder alloy was investigated under the isothermal condition. Creep tests were conducted under a range of stresses and temperatures. Creep lifetime data were analyzed by the combined time-temperature equations following the Sherby, Larsen-Miller, and Manson-Haferd approaches. From these analyses, a series of material parameters were obtained from the experimental data. The results showed that the Manson-Hanferd method provided a better correlation with the creep rupture data. The mechanisms of creep deformation and rupture at different time-temperature combinations are discussed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 585-588 |
| Number of pages | 4 |
| Journal | Key Engineering Materials |
| Volume | 345-346 I |
| DOIs | |
| State | Published - 2007 |
| Externally published | Yes |
Keywords
- Creep rupture
- Parametric methods
- Pb-free alloy
- Sn3.8Ag0.7Cu
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering