Creep rupture of Sn-Ag-Cu Pb-free solder alloy

L. Zhang, Z. G. Wang, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

The eutectic Sn3.8Ag0.7Cu alloy is widely considered a leading Pb-free replacement for the eutectic Pb-Sn solder alloy in electronic packaging where creep deformation and rupture is a major concern. In this study, creep rupture behavior of Sn-Ag-Cu solder alloy was investigated under the isothermal condition. Creep tests were conducted under a range of stresses and temperatures. Creep lifetime data were analyzed by the combined time-temperature equations following the Sherby, Larsen-Miller, and Manson-Haferd approaches. From these analyses, a series of material parameters were obtained from the experimental data. The results showed that the Manson-Hanferd method provided a better correlation with the creep rupture data. The mechanisms of creep deformation and rupture at different time-temperature combinations are discussed.

Original languageEnglish (US)
Pages (from-to)585-588
Number of pages4
JournalKey Engineering Materials
Volume345-346 I
DOIs
StatePublished - 2007

Keywords

  • Creep rupture
  • Parametric methods
  • Pb-free alloy
  • Sn3.8Ag0.7Cu

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Creep rupture of Sn-Ag-Cu Pb-free solder alloy'. Together they form a unique fingerprint.

Cite this