Creep and relaxation behavior of woven glass/epoxy substrates for multilayer circuit board applications

Keyphrases

• Relaxation Behavior 100%
• Creep Behavior 100%
• Multilayer Circuit Boards 100%
• Glass Epoxy Substrate 100%
• Glass-epoxy Composite 66%
• Creep Compliance 66%
• Resin 66%
• Temperature Range 33%
• Elastic Properties 33%
• Epoxy Matrix 33%
• Time-temperature Superposition 33%
• Micromechanical Modeling 33%
• Model Prediction 33%
• Master Creep 33%
• Creep Data 33%
• Composite Substrate 33%
• Creep Curve 33%
• Thermorheologically Simple 33%
• Prony Series 33%
• Dynamic Mechanical Analysis 33%
• FR4 Substrate 33%
• Glass Relaxation 33%
• Laplace Domain 33%
• Glass Fabric 33%
• Fabric Movement 33%

Engineering

• Creep 100%
• Epoxy Glass 100%
• Epoxy Composite 40%
• Neat Resin 40%
• Temperature Range 20%
• Epoxy Matrix 20%
• Micromechanical Model 20%
• Model Prediction 20%
• Creep Data 20%
• Laplace Domain 20%
• Temperature Superposition Principle 20%
• Dynamic Mechanical Analysis 20%

Material Science

• Electronic Circuit 100%
• Creep 100%
• Composite Material 100%
• Elastic Property 20%
• Creep Property 20%
• Dynamic Mechanical Analysis 20%