Coupling-aware mixed dummy metal insertion for lithography

Liang Deng, Martin D.F. Wong, Kai Yuan Chao, Hua Xiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution


As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called off-axis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.

Original languageEnglish (US)
Title of host publicationDesign for Manufacturability through Design-Process Integration
StatePublished - 2007
EventDesign for Manufacturability through Design-Process Integration - San Jose, CA, United States
Duration: Feb 28 2007Mar 2 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherDesign for Manufacturability through Design-Process Integration
Country/TerritoryUnited States
CitySan Jose, CA


  • Assist feature
  • Coupling capacitance
  • Lithography cost
  • RET
  • SPAF

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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