Coupled Mesoscale - Continuum Simulations of Copper Electrodeposition in a Trench

Timothy O. Drews, Eric G. Webb, David L. Ma, Jay Alameda, Richard D. Braatz, Richard C Alkire

Research output: Contribution to journalArticle

Abstract

Copper electrodeposition in submicron trenches involves phenomena that span many orders of magnitude in time and length scales. In the present work, two codes that simulate electrochemical phenomena on different time and length scales were externally linked. A Monte Carlo code simulated surface phenomena in order to resolve surface roughness evolution and trench in-fill. A 2-D finite difference code simulated transport phenomena in the diffusion boundary layer outside the trench. The continuum code passed fluxes to the Monte Carlo code, which passed back a concentration to the continuum code. A numerical instability that arises in the multiscale linked code was suppressed by filtering the concentration data passed from the Monte Carlo code to the finite difference code. The resulting simulation results were self-consistent for a sufficiently small amount of filtering.

Original languageEnglish (US)
Pages (from-to)226-240
Number of pages15
JournalAIChE Journal
Volume50
Issue number1
DOIs
StatePublished - Jan 1 2004

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Electroplating
Electrodeposition
Copper
Surface phenomena
Boundary layers
Surface roughness
Fluxes

Keywords

  • Copper electrodeposition
  • Interconnect
  • Multiscale simulations

ASJC Scopus subject areas

  • Biotechnology
  • Chemical Engineering(all)
  • Mechanical Engineering
  • Environmental Engineering
  • Polymers and Plastics

Cite this

Coupled Mesoscale - Continuum Simulations of Copper Electrodeposition in a Trench. / Drews, Timothy O.; Webb, Eric G.; Ma, David L.; Alameda, Jay; Braatz, Richard D.; Alkire, Richard C.

In: AIChE Journal, Vol. 50, No. 1, 01.01.2004, p. 226-240.

Research output: Contribution to journalArticle

Drews, Timothy O. ; Webb, Eric G. ; Ma, David L. ; Alameda, Jay ; Braatz, Richard D. ; Alkire, Richard C. / Coupled Mesoscale - Continuum Simulations of Copper Electrodeposition in a Trench. In: AIChE Journal. 2004 ; Vol. 50, No. 1. pp. 226-240.
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