Coupled Electrical-Thermal-Mechanical Simulation for the Reliability Analysis of Large-Scale 3-D Interconnects

Tianjian Lu, Jian Ming Jin

Research output: Contribution to journalArticle

Abstract

A multiphysics simulation technique based on the finite element method is developed for the reliability analysis of interconnects. The multiphysics simulation characterizes multidisciplinary, including electrical, thermal, and mechanical, aspects of interconnects. It is well known that the major bottleneck preventing 3-D simulations from gaining further popularity is the computational efficiency in dealing with practically large-scale problems. To address this problem, the proposed multiphysics simulation is devised for analyzing large-scale problems with a significantly improved computational efficiency through utilizing a domain decomposition scheme called the finite element tearing and interconnecting, parallel computing, and the localized nature of thermal stresses in the interconnect structures. Both the capability and efficiency of the multiphysics simulation are demonstrated through analyzing large-scale interconnect structures including arrays of solder bumps and bonding wires. Detailed temperature distributions and localized stresses of large amplitude are obtained through the proposed simulation in a highly efficient manner.

Original languageEnglish (US)
Article number7820068
Pages (from-to)229-237
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume7
Issue number2
DOIs
StatePublished - Feb 2017

Keywords

  • Bonding wire
  • Thermoelasticity
  • domain decomposition
  • finite element method (FEM)
  • multiphysics modeling
  • parallel computing
  • solder bump

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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