Coupled electrical-thermal-fluid simulation for large-scale circuits with integrated microchannels

Tianjian Lu, Jianming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A coupled electrical-thermal-fluid simulation technique is developed based on the finite element method. The coupled simulation, which integrates the full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses into an iterative scheme, is devised for circuit designs with integrated micro channel cooling. The motion of fluid flow is decoupled from temperature under the assumption of incompressible and fully developed flows. The full-wave electromagnetic and the transient conjugate heat transfer analyses are coupled through temperature-dependent material properties. The efficiency of the coupled simulation is enhanced through several numerical techniques including an adaptive time stepping scheme, a domain decomposition scheme called the finite element tearing and interconnecting (FETI), and FETI-enabled parallel computing. The capability and the efficiency of the coupled simulation are demonstrated through a numerical example.

Original languageEnglish (US)
Title of host publication2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages203-205
Number of pages3
ISBN (Electronic)9781509061846
DOIs
StatePublished - Apr 5 2017
Event2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States
Duration: Dec 14 2016Dec 16 2016

Publication series

Name2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

Other

Other2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
CountryUnited States
CityHonolulu
Period12/14/1612/16/16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Modeling and Simulation

Fingerprint Dive into the research topics of 'Coupled electrical-thermal-fluid simulation for large-scale circuits with integrated microchannels'. Together they form a unique fingerprint.

Cite this