TY - GEN
T1 - Coupled electrical-thermal-fluid simulation for large-scale circuits with integrated microchannels
AU - Lu, Tianjian
AU - Jin, Jian Ming
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2017/4/5
Y1 - 2017/4/5
N2 - A coupled electrical-thermal-fluid simulation technique is developed based on the finite element method. The coupled simulation, which integrates the full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses into an iterative scheme, is devised for circuit designs with integrated micro channel cooling. The motion of fluid flow is decoupled from temperature under the assumption of incompressible and fully developed flows. The full-wave electromagnetic and the transient conjugate heat transfer analyses are coupled through temperature-dependent material properties. The efficiency of the coupled simulation is enhanced through several numerical techniques including an adaptive time stepping scheme, a domain decomposition scheme called the finite element tearing and interconnecting (FETI), and FETI-enabled parallel computing. The capability and the efficiency of the coupled simulation are demonstrated through a numerical example.
AB - A coupled electrical-thermal-fluid simulation technique is developed based on the finite element method. The coupled simulation, which integrates the full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses into an iterative scheme, is devised for circuit designs with integrated micro channel cooling. The motion of fluid flow is decoupled from temperature under the assumption of incompressible and fully developed flows. The full-wave electromagnetic and the transient conjugate heat transfer analyses are coupled through temperature-dependent material properties. The efficiency of the coupled simulation is enhanced through several numerical techniques including an adaptive time stepping scheme, a domain decomposition scheme called the finite element tearing and interconnecting (FETI), and FETI-enabled parallel computing. The capability and the efficiency of the coupled simulation are demonstrated through a numerical example.
UR - http://www.scopus.com/inward/record.url?scp=85018441934&partnerID=8YFLogxK
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U2 - 10.1109/EDAPS.2016.7893164
DO - 10.1109/EDAPS.2016.7893164
M3 - Conference contribution
AN - SCOPUS:85018441934
T3 - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
SP - 203
EP - 205
BT - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
Y2 - 14 December 2016 through 16 December 2016
ER -