Abstract
High resolution photoelasticity was utilized to study the internal stresses induced during actuation of an embedded shape memory alloy wire in a polymer matrix. In particular, the influence of several wire surface treatments on the resulting stresses and load transfer were investigated. Four different surface treatments were considered: untreated, acid etched, hand sanded and sandblasted. Pull-out data indicated that sandblasting of wires increased the SMA/polymer interfacial bond strength while hand sanding and acid cleaning actually decreased the bond strength. Wires with greater adhesion (sandblasted) resulted in higher stresses induced in the polymer while those with lower adhesion transferred less load. Overall, properties of the SMA/polymer interface were shown to significantly affect the performance of the embedded SMA actuator.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 121-128 |
| Number of pages | 8 |
| Journal | American Society of Mechanical Engineers, Applied Mechanics Division, AMD |
| Volume | 206 |
| State | Published - 1995 |
| Event | Proceedings of the 1995 Joint ASME Applied Mechanics and Materials Summer Meeting - Los Angeles, CA, USA Duration: Jun 28 1995 → Jun 30 1995 |
ASJC Scopus subject areas
- Mechanical Engineering