Copper deposition in the presence of surface-confined additives

Keyphrases

• Alkanethiol 100%
• Applied Current Density 50%
• Au Electrode 50%
• Chain Length 100%
• Copper Deposition 100%
• Cyclic Voltammetry 50%
• Defect Density 50%
• Electrodeposit 50%
• Electrodeposition 50%
• Galvanostatic Deposition 50%
• High Current Density 50%
• In Situ Atomic Force Microscopy 50%
• Nucleation Centers 50%
• Over Potential 50%
• Short Chain 50%
• Spectroscopic Analysis 50%
• Sulfuric Acid Solution 50%
• Surface-confined 100%
• Thiolate 50%
• Thiols 50%
• X-ray Photoelectron 50%
• X-ray Photoelectron Spectroscopy 50%

Material Science

• Atomic Force Microscopy 25%
• Cyclic Voltammetry 25%
• Defect Density 25%
• Density 50%
• Electrodeposition 25%
• Monolayers 100%
• Nucleation 25%
• Photoemission Spectroscopy 25%
• Surface (Surface Science) 100%
• X-Ray Photoelectron Spectroscopy 25%

Chemical Engineering

• Electrodeposition 100%
• Sulfuric Acid 100%