Copper alloy-stainless steel bonded laminates for fusion reactor applications: Crack growth and fatigue

K. D. Leedy, J. F. Stubbins

Research output: Contribution to journalArticle


Fatigue and crack growth in copper alloy-stainless steel bi-layer panels joined by hot isostatic pressing or explosive bonding were tested over the temperature range 25-225 °C. Several material combinations under consideration for fusion reactor first wall applications were studied: solid plates of precipitation strengthened CuNiBe or dispersion strengthened CuAl2O3 bonded to a 316L stainless steel plate and Cu-Al2O3 in a powder form consolidated and bonded concurrently to a 316L stainless steel plate. Fatigue and crack growth were measured perpendicular to the interface through the copper alloy. Crack growth was also measured parallel to the interface along the bond line. The solid Cu-Al2O3-stainless steel laminate exhibited the best perpendicular crack growth resistance and fatigue performance of the bonded panels due primarily to the elongated Cu-Al2O3 grains oriented perpendicular to the crack propagation direction. Before reaching the interface cracks propagating perpendicular to the interface caused delamination in most panels near the copper alloy-stainless steel bond line within the copper alloy. All bi-layer panels displayed minimal resistance to parallel crack growth.

Original languageEnglish (US)
Pages (from-to)19-25
Number of pages7
JournalMaterials Science and Engineering A
Issue number1-2
StatePublished - Jan 15 2001

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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