Abstract
The tensile strength of copper alloy-stainless steel bi-layer panels joined by hot isostatic pressing or explosive bonding was tested over a temperature range 25-350 °C. The bonding processes caused changes in interfacial microstructures which affected the interfacial mechanical properties. Hot isostatic pressed materials studied included: precipitation strengthened CuNiBe or dispersion strengthened Cu-Al2O3 bonded to 316L stainless steel plates and Cu-Al2O3 bonded to Cu-Al2O3. An explosive bonded panel of Cu-Al2O3-316L stainless steel was also examined. Hot isostatic pressed panels showed similar decreasing shear strengths with increasing temperature, while the explosive bonded panel displayed substantially higher strength at 25 °C but declined rapidly as the test temperature increased. Tensile strengths of all panels were nominally lower than the constituent bulk material strengths and delamination near the copper alloy-stainless steel interface was the dominate failure mode in the bi-metallic panels. The joining processes were found to alter the microstructure of the bond interfacial regions in the form of microporosity and Fe-Cr-B precipitate formation, NiBe precipitate morphology changes and interdiffusion of constituent elements.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 10-18 |
| Number of pages | 9 |
| Journal | Materials Science and Engineering A |
| Volume | 297 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - Jan 15 2001 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering