Control and quantification of residual stresses in anodically bonded MEMS structures

R. Inzinga, T. Lin, M. Yadav, Harley T Johnson, G. P. Horn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Residual stresses in anodically bonded silicon devices can result in quality control and process control deficits if the stresses are not controlled. At the same time several geometries may benefit from a controlled introduction of residual stresses. For example, long, thin structures may utilize a residual tensile stress to minimize the likelihood of buckling, while etched cavities with sharp corners can benefit from a residual compressive stress to suppress crack initiation and growth. In the present work, we quantify the residual stress fields present in silicon wafers that are anodically bonded to virgin Pyrex wafers. Anodic bonding is conducted using standard procedures as well as a proposed alternative method that utilizes differential thermal bonding to control the residual stress state. The experimental stress state is compared to theoretical finite element calculations to determine the capability of controlling stresses based on a simple thermal model.

Original languageEnglish (US)
Title of host publicationMEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics
Pages269-273
Number of pages5
StatePublished - Jul 19 2011
Event2010 Annual Conference on Experimental and Applied Mechanics - Indianapolis, IN, United States
Duration: Jun 7 2010Jun 10 2010

Publication series

NameConference Proceedings of the Society for Experimental Mechanics Series
Volume2
ISSN (Print)2191-5644
ISSN (Electronic)2191-5652

Other

Other2010 Annual Conference on Experimental and Applied Mechanics
CountryUnited States
CityIndianapolis, IN
Period6/7/106/10/10

Fingerprint

MEMS
Residual stresses
Silicon wafers
Compressive stress
Crack initiation
Tensile stress
Buckling
Process control
Quality control
Crack propagation
Silicon
Geometry
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering

Cite this

Inzinga, R., Lin, T., Yadav, M., Johnson, H. T., & Horn, G. P. (2011). Control and quantification of residual stresses in anodically bonded MEMS structures. In MEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics (pp. 269-273). (Conference Proceedings of the Society for Experimental Mechanics Series; Vol. 2).

Control and quantification of residual stresses in anodically bonded MEMS structures. / Inzinga, R.; Lin, T.; Yadav, M.; Johnson, Harley T; Horn, G. P.

MEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics. 2011. p. 269-273 (Conference Proceedings of the Society for Experimental Mechanics Series; Vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Inzinga, R, Lin, T, Yadav, M, Johnson, HT & Horn, GP 2011, Control and quantification of residual stresses in anodically bonded MEMS structures. in MEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics. Conference Proceedings of the Society for Experimental Mechanics Series, vol. 2, pp. 269-273, 2010 Annual Conference on Experimental and Applied Mechanics, Indianapolis, IN, United States, 6/7/10.
Inzinga R, Lin T, Yadav M, Johnson HT, Horn GP. Control and quantification of residual stresses in anodically bonded MEMS structures. In MEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics. 2011. p. 269-273. (Conference Proceedings of the Society for Experimental Mechanics Series).
Inzinga, R. ; Lin, T. ; Yadav, M. ; Johnson, Harley T ; Horn, G. P. / Control and quantification of residual stresses in anodically bonded MEMS structures. MEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics. 2011. pp. 269-273 (Conference Proceedings of the Society for Experimental Mechanics Series).
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