Control and quantification of residual stresses in anodically bonded MEMS structures

R. Inzinga, T. Lin, M. Yadav, H. T. Johnson, G. P. Horn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Residual stresses in anodically bonded silicon devices can result in quality control and process control deficits if the stresses are not controlled. At the same time several geometries may benefit from a controlled introduction of residual stresses. For example, long, thin structures may utilize a residual tensile stress to minimize the likelihood of buckling, while etched cavities with sharp comers can benefit from a residual compressive stress to suppress crack initiation and growth. In the present work, we quantify the residual stress fields present in silicon wafers that are anodically bonded to virgin Pyrex wafers. Anodic bonding is conducted using standard procedures as well as a proposed alternative method that utilizes differential thermal bonding to control the residual stress state. The experimental stress state is compared to theoretical finite element calculations to determine the capability of controlling stresses based on a simple thermal model.

Original languageEnglish (US)
Title of host publicationSociety for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2010
Pages2366-2370
Number of pages5
StatePublished - Nov 9 2010
EventSEM Annual Conference and Exposition on Experimental and Applied Mechanics 2010 - Indianapolis, IN, United States
Duration: Jun 7 2010Jun 10 2010

Publication series

NameSociety for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2010
Volume3

Other

OtherSEM Annual Conference and Exposition on Experimental and Applied Mechanics 2010
CountryUnited States
CityIndianapolis, IN
Period6/7/106/10/10

ASJC Scopus subject areas

  • Mechanics of Materials

Fingerprint Dive into the research topics of 'Control and quantification of residual stresses in anodically bonded MEMS structures'. Together they form a unique fingerprint.

Cite this