TY - GEN
T1 - Contact printing with nanometer resolution
AU - Loo, Y. L.
AU - Willett, R. L.
AU - Baldwin, K. W.
AU - Rogers, J. A.
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - Developed a purely additive contact printing technique that can, in a single step, form complex patterns of functional materials with nanometer resolution. This method can print directly nanostructures without the use of sacrificial resists, etching procedures or post-patterning deposition steps that are often required with other nanolithographic techniques. It is operationally simple, compatible with a wide range of materials (metals, dielectrics, etc.) and substrates (rigid inorganics, flexible plastics, etc.) and capable of patterning large areas under ambient conditions. The method, which we refer to as nanotransfer printing (nTP), involves the controlled transfer of material from the raised regions of reusable stamps onto the surfaces of substrates. Pattern transfer is driven by interfacial chemical and physical reactions that are initiated when the substrate and the stamp are brought into contact. We demonstrate the versatility of nTP by printing nanometer and micron scale metal patterns in the geometries of 2D photonic waveguides and electrostatic lenses and by building two functional devices on flexible substrates: high performance organic thin film transistors (TFTs) and thin film inorganic metal-insulator-metal (MIM) capacitors.
AB - Developed a purely additive contact printing technique that can, in a single step, form complex patterns of functional materials with nanometer resolution. This method can print directly nanostructures without the use of sacrificial resists, etching procedures or post-patterning deposition steps that are often required with other nanolithographic techniques. It is operationally simple, compatible with a wide range of materials (metals, dielectrics, etc.) and substrates (rigid inorganics, flexible plastics, etc.) and capable of patterning large areas under ambient conditions. The method, which we refer to as nanotransfer printing (nTP), involves the controlled transfer of material from the raised regions of reusable stamps onto the surfaces of substrates. Pattern transfer is driven by interfacial chemical and physical reactions that are initiated when the substrate and the stamp are brought into contact. We demonstrate the versatility of nTP by printing nanometer and micron scale metal patterns in the geometries of 2D photonic waveguides and electrostatic lenses and by building two functional devices on flexible substrates: high performance organic thin film transistors (TFTs) and thin film inorganic metal-insulator-metal (MIM) capacitors.
KW - Additives
KW - Dielectric materials
KW - Dielectric substrates
KW - Etching
KW - Metal-insulator structures
KW - Nanostructured materials
KW - Nanostructures
KW - Organic thin film transistors
KW - Printing
KW - Resists
UR - http://www.scopus.com/inward/record.url?scp=84948658727&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84948658727&partnerID=8YFLogxK
U2 - 10.1109/DRC.2002.1029566
DO - 10.1109/DRC.2002.1029566
M3 - Conference contribution
AN - SCOPUS:84948658727
T3 - Device Research Conference - Conference Digest, DRC
SP - 149
EP - 150
BT - 60th Device Research Conference, DRC 2002
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 60th Device Research Conference, DRC 2002
Y2 - 24 June 2002 through 26 June 2002
ER -