Congestion barcodes: Exploring the topology of urban congestion using persistent homology

Yu Wu, Gabriel Shindnes, Vaibhav Karve, Derrek Yager, Daniel B. Work, Arnab Chakraborty, Richard B. Sowers

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work presents a new method to quantify connectivity in transportation networks. Inspired by the field of topological data analysis, we propose a novel approach to explore the robustness of road network connectivity in the presence of congestion on the roadway. The robustness of the pattern is summarized in a congestion barcode, which can be constructed directly from traffic datasets commonly used for navigation. As an initial demonstration, we illustrate the main technique on a publicly available traffic dataset in a neighborhood in New York City.

Original languageEnglish (US)
Title of host publication2017 IEEE 20th International Conference on Intelligent Transportation Systems, ITSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
ISBN (Electronic)9781538615256
DOIs
StatePublished - Mar 14 2018
Event20th IEEE International Conference on Intelligent Transportation Systems, ITSC 2017 - Yokohama, Kanagawa, Japan
Duration: Oct 16 2017Oct 19 2017

Publication series

NameIEEE Conference on Intelligent Transportation Systems, Proceedings, ITSC
Volume2018-March

Other

Other20th IEEE International Conference on Intelligent Transportation Systems, ITSC 2017
CountryJapan
CityYokohama, Kanagawa
Period10/16/1710/19/17

ASJC Scopus subject areas

  • Automotive Engineering
  • Mechanical Engineering
  • Computer Science Applications

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  • Cite this

    Wu, Y., Shindnes, G., Karve, V., Yager, D., Work, D. B., Chakraborty, A., & Sowers, R. B. (2018). Congestion barcodes: Exploring the topology of urban congestion using persistent homology. In 2017 IEEE 20th International Conference on Intelligent Transportation Systems, ITSC 2017 (pp. 1-6). (IEEE Conference on Intelligent Transportation Systems, Proceedings, ITSC; Vol. 2018-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITSC.2017.8317777