Conformal mesh for thermal imaging

Chang Liu (Inventor), Nannan I Chen (Inventor), Jonathan Engel (Inventor), Jack Chen (Inventor), Zhifang Fan (Inventor)

Research output: Patent


This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.
Original languageEnglish (US)
U.S. patent number7768376
StatePublished - Aug 3 2010


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