Abstract
The field of microelectromechanical system (MEMS) is extremely broad, including application such as pressure sensors, scanning probe tips, flow sensors, valves, micromotors and chemical analysis on a chip. Many MEMS structures are geometrically complicated, electrochemically coupled, and inherently three-dimensional. The solution of the multidomain physics problems including electrical, mechanical, thermal and fluidics effects need to be accurately simulated to correctly predict device performance. In addition, the integrated circuit fabrication techniques widely used in MEMS devices require the modeling of complex material behavior and processing such as etching, oxidation, deposition, and diffusion.
| Original language | English (US) |
|---|---|
| Title of host publication | Micro-Electro-Mechanical Systems (MEMS) |
| Editors | R.J. Furness |
| Publisher | ASME |
| Pages | 525 |
| Number of pages | 1 |
| Volume | 66 |
| State | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 ASME International Mechanical Engineering Congress and Exposition - Anaheim, CA, USA Duration: Nov 15 1998 → Nov 20 1998 |
Other
| Other | Proceedings of the 1998 ASME International Mechanical Engineering Congress and Exposition |
|---|---|
| City | Anaheim, CA, USA |
| Period | 11/15/98 → 11/20/98 |
ASJC Scopus subject areas
- Software
- Mechanical Engineering
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