Comprehensive models for the investigation of on-chip switching noise generation and coupling

Jae Yong Ihm, In Jae Chung, Giorgos Manetas, Andreas C Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A comprehensive modeling methodology is presented for the investigation of on-chip noise generation and coupling due to power switching. The methodology utilizes a comprehensive electromagnetic model for the on-chip portion of the power grid. Thus, the tedious and error-prone extraction of a distributed RLC model for the power grid is avoided and the generated model allows for power grid induced broadband and distributed noise coupling to be taken into account in the transient simulation. The electromagnetic model for the power grid is complemented by a distributed RC model for the semiconductor substrate and RLCG models for the interconnects. Thus, a comprehensive model results for the quantification of on-chip interconnect and power grid noise effects during switching. Transient simulations using this model are carried out using a hybrid time-domain integration scheme which combines a SPICE-like engine for the analysis of all RLCG netlists and the nonlinear drivers incorporated in the model with a numerical integration algorithm for the discrete electromagnetic model for the power grid.

Original languageEnglish (US)
Title of host publication2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Pages666-671
Number of pages6
DOIs
StatePublished - 2005
Event2005 International Symposium on Electromagnetic Compatibility, EMC 2005 - Chicago, IL, United States
Duration: Aug 8 2005Aug 12 2005

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume2
ISSN (Print)1077-4076

Other

Other2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Country/TerritoryUnited States
CityChicago, IL
Period8/8/058/12/05

Keywords

  • FDTD/SPICE hybrid trasient simulation
  • On-chip power grid swithcing
  • Power-grid common-impedance coupling
  • Substrate noise coupling
  • Switching noise analysis

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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