TY - GEN
T1 - Comprehensive broadband electromagnetic modeling of on-chip interconnects with a Surface discretization-based generalized PEEC model
AU - Rong, Aosheng
AU - Cangellaris, Andreas C.
AU - Dong, Limin
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - This paper proposes a comprehensive integral equation electromagnetic field solver for broadband modeling of on-chip interconnects. Instead of the computationally intensive volumetric discretization model, which appears to be currently the most popular method of choice for handling the tall and narrow cross sections of the on-chip wiring and capturing correctly the impact of adjacent wiring coupling and skin effect, tbe proposed generalized Partial Element Equivalent Circuit (PEEC) methodology utilizes a computationally more efficient conductor surface discretization. Key to the success of such a surface discretization model is the definition of a position- And frequency-dependent surface impedance used to relate the tangential electric field and current on the wire surface. A novel strategy for the identification of loops in the resulting discrete model leads to a numerically-stable and efficient mesh analysis-based PEEC formulation in support of on-chip interconnect electromagnetic modeling from DC to multi-GHz frequencies.
AB - This paper proposes a comprehensive integral equation electromagnetic field solver for broadband modeling of on-chip interconnects. Instead of the computationally intensive volumetric discretization model, which appears to be currently the most popular method of choice for handling the tall and narrow cross sections of the on-chip wiring and capturing correctly the impact of adjacent wiring coupling and skin effect, tbe proposed generalized Partial Element Equivalent Circuit (PEEC) methodology utilizes a computationally more efficient conductor surface discretization. Key to the success of such a surface discretization model is the definition of a position- And frequency-dependent surface impedance used to relate the tangential electric field and current on the wire surface. A novel strategy for the identification of loops in the resulting discrete model leads to a numerically-stable and efficient mesh analysis-based PEEC formulation in support of on-chip interconnect electromagnetic modeling from DC to multi-GHz frequencies.
UR - http://www.scopus.com/inward/record.url?scp=15944427298&partnerID=8YFLogxK
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U2 - 10.1109/EPEP.2003.1250070
DO - 10.1109/EPEP.2003.1250070
M3 - Conference contribution
AN - SCOPUS:15944427298
T3 - Electrical Performance of Electronic Packaging
SP - 367
EP - 370
BT - Electrical Performance of Electronic Packaging
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Electrical Performance of Electronic Packaging, 2003
Y2 - 27 October 2003 through 29 October 2003
ER -