Comparison of techniques for bonding VCSELS directly to ICs

Rui Pu, E. M. Hayes, C. W. Wilmsen, K. D. Choquette, H. Q. Hou, K. M. Geib

Research output: Contribution to journalArticlepeer-review


This paper reports the successful bonding of 8 × 8 and 4 × 4 VCSEL arrays to Si CMOS and GaAs MESFET integrated circuits and to GaAs substrates. Three different bonding techniques are demonstrated and their electrical, optical and mechanical characteristics are compared. All three techniques remove the substrate from the VCSEL wafer, leaving individual VCSELs bonded directly to locations within the integrated circuit.

Original languageEnglish (US)
Pages (from-to)324-329
Number of pages6
JournalJournal of Optics A: Pure and Applied Optics
Issue number2
StatePublished - Mar 1999
Externally publishedYes

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics


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