Comparison of electrical, optical and plasmonic on-chip interconnects based on delay and energy considerations

Keyphrases

• Plasmonics 100%
• Energy Considerations 100%
• Optical Interconnects 100%
• On-chip Interconnects 100%
• Plasmonic Interconnects 100%
• Fundamental Limitations 40%
• Local Interconnect 40%
• Bandwidth Density 40%
• Plasmonic Switch 40%
• Silica 20%
• Order of Magnitude 20%
• On chip 20%
• Interconnection Technology 20%
• Dielectric 20%
• Device Dimensions 20%
• Shot Noise 20%
• High Bandwidth 20%
• Energy Dissipation 20%
• Integration Level 20%
• Am(III) 20%
• Wavelength Division multiplexing 20%
• Free Space 20%
• Energy Efficient 20%
• Global Level 20%
• Four-channel 20%
• Signal Conversion 20%
• Technology Options 20%
• Technology Node 20%
• Energy per Bit 20%
• Propagation Length 20%
• Plasmonic Waveguide 20%
• Interconnect Delay 20%
• Copper Interconnect 20%
• Energy Comparison 20%

Medicine and Dentistry

• Dissipation 100%
• Integration Level 100%
• Wavelength-Division Multiplexing 100%

Physics

• Optical Interconnect 100%
• Warm Dark Matter 40%
• Waveguide 20%
• Wavelength-Division Multiplexing 20%
• Dielectric Material 20%