Comparison of dynamic and quasi-static measurements of thin film adhesion

Keyphrases

• Fracture Energy 100%
• Quasi-static Test 100%
• Thin Film Adhesion 100%
• Pulse Amplitude 60%
• Interfacial Fracture Energy 40%
• Laser-induced Stress Wave 40%
• Dynamic Delamination 40%
• Four-point Bending Test 40%
• Adhesive Failure 20%
• Silicon Substrate 20%
• Sample Preparation 20%
• Rate Dependence 20%
• Kinetic Energy 20%
• Multilayer Thin Films 20%
• Well-defined 20%
• Delamination 20%
• Adhesion Properties 20%
• Energy Increase 20%
• Plastic Deformation 20%
• Quasi-static 20%
• Laser Fluence 20%
• Thin Systems 20%
• Aluminum Thin Films 20%
• Four-point Bending 20%
• Pre-crack 20%
• Low Amplitude 20%
• Testing Protocol 20%
• Stress Wave 20%
• Thin Film Interface 20%
• Plateau Value 20%
• Efficient Conversion 20%
• Dynamic Loading Conditions 20%
• Control Dynamics 20%
• Attendants 20%
• Quasi-static Conditions 20%
• Stress Pulse 20%
• Pulse Wave Velocity 20%
• Aluminum-silicon Alloy 20%
• Complex Analysis 20%
• Critical Fracture Energy 20%
• Dynamic Fracture Energy 20%
• Microelectronics Industry 20%

Engineering

• Thin Films 100%
• Fracture Energy 100%
• Delamination 42%
• Stress Wave 42%
• Pulse Amplitude 42%
• Interfacial Fracture Energy 28%
• Induced Stress 28%
• Energy Engineering 14%
• Silicon Substrate 14%
• Microelectronics 14%
• Measured Value 14%
• Plastic Deformation 14%
• Rate Dependence 14%
• Dynamic Fracture 14%
• Adhesive Failure 14%
• Laser Fluence 14%
• Dynamic Loading Condition 14%
• Quasistatic Condition 14%
• Stress Pulse 14%
• Critical Fracture 14%
• Pulse Velocity 14%

Material Science

• Thin Films 100%
• Delamination 60%
• Silicon 40%
• Aluminum 40%
• Film 20%
• Plastic Deformation 20%
• Dynamic Loads 20%
• Dynamic Fracture 20%