Comparing FICDM and wafer-level CDM test methods: Apples to oranges?

Nathan Jack, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The on-chip stresses induced by FICDM, WCDM2, CC-TLP, and VF-TLP are compared on the basis of voltage monitor readings and IC functional failures. In general, core circuit failures induced by FICDM are replicated on the wafer level. Package-related parasitics increase the FICDM current rise-time at an I/O pad relative to that measured externally, causing miscorrelation with wafer-level testers.

Original languageEnglish (US)
Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012
StatePublished - Nov 27 2012
Event34th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2012 - Tucson, AZ, United States
Duration: Sep 9 2012Sep 14 2012

Publication series

NameElectrical Overstress/Electrostatic Discharge Symposium Proceedings
ISSN (Print)0739-5159

Other

Other34th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2012
CountryUnited States
CityTucson, AZ
Period9/9/129/14/12

Fingerprint

Networks (circuits)
Electric potential

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Jack, N., & Rosenbaum, E. (2012). Comparing FICDM and wafer-level CDM test methods: Apples to oranges? In Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012 [6333309] (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Comparing FICDM and wafer-level CDM test methods : Apples to oranges? / Jack, Nathan; Rosenbaum, Elyse.

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012. 2012. 6333309 (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jack, N & Rosenbaum, E 2012, Comparing FICDM and wafer-level CDM test methods: Apples to oranges? in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012., 6333309, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 34th International Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2012, Tucson, AZ, United States, 9/9/12.
Jack N, Rosenbaum E. Comparing FICDM and wafer-level CDM test methods: Apples to oranges? In Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012. 2012. 6333309. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).
Jack, Nathan ; Rosenbaum, Elyse. / Comparing FICDM and wafer-level CDM test methods : Apples to oranges?. Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012. 2012. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).
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