Communication technologies for exascale systems

J. A. Kash, P. Pepeljugoski, F. E. Doany, C. L. Schow, D. M. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. J. Offrein, Y. Vlasov, W. Green, F. Xia, C. W. Baks, Y. H. Kwark, D. G. Kam, M. B. Ritter

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Scaling computing systems to Exaflops (1018 floating point operations per second) will require tremendous increases in communications bandwidth but with greatly reduced power consumption per communicated bit as compared to today's petaflop machines. Reaching the required performance in both density and power consumption will be extremely challenging. Electrical and optical interconnect technologies that may be part of the solution are summarized, including advanced electrical printed circuit boards, VCSEL-array based optical interconnects over multimode fibers or waveguides, and singlemode silicon photonics. The use of optical interconnects will play an ever-larger role in intrasystem communications. Although optics is used today primarily between racks, it will gradually migrate into backplanes, circuit cards, and eventually even on-chip.

Original languageEnglish (US)
Title of host publicationPhotonics Packaging, Integration, and Interconnects IX
StatePublished - Jun 15 2009
Externally publishedYes
EventPhotonics Packaging, Integration, and Interconnects IX - San Jose, CA, United States
Duration: Jan 26 2009Jan 28 2009

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherPhotonics Packaging, Integration, and Interconnects IX
Country/TerritoryUnited States
CitySan Jose, CA


  • Exascale
  • Optical interconnects
  • Parallel optics
  • Silicon photonics
  • Supercomputers

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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