Combined lumped and continuum parameter design optimization of electro-thermal systems

Danny J. Lohan, James T. Allison, Ercan M. Dede, Masanori Ishigaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this article we explore a coupled design strategy for the simultaneous optimization of lumped-parameter (electrical) and continuum parameter (thermal) systems. In terms of electrical circuit response, advances in the development of wide band-gap semiconductors and the high speed transient behavior of these devices leads to challenges associated with damping or overshoot. To address such issues, traditional circuit design strategies should evolve to incorporate next generation electrical components effectively. Thus, we propose the incorporated design of circuit layout and routing in conjunction with heat spreader design as a more comprehensive means to optimize the layout of power-dense electronics. The effects of this multidisciplinary design are evaluated by analyzing the Pareto set, which was observed to shift towards the utopia point with each additional design consideration.

Original languageEnglish (US)
Title of host publication42nd Design Automation Conference
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791850114
DOIs
StatePublished - 2016
EventASME 2016 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2016 - Charlotte, United States
Duration: Aug 21 2016Aug 24 2016

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume2B-2016

Other

OtherASME 2016 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2016
CountryUnited States
CityCharlotte
Period8/21/168/24/16

ASJC Scopus subject areas

  • Mechanical Engineering
  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Modeling and Simulation

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