@inproceedings{d2c980601cce41b4a52f137a8c6ea38d,
title = "CMP aware shuttle mask floorplanning",
abstract = "By putting different chips on the same mask, shuttle mask (or multiple project wafer) provides an economical solution for low volume designs and design prototypes to share the rising mask cost. A challenging floorplanning problem is to optimally pack these chips according to objectives and constraints related to cost and manufacturability. In this paper, we study the problem of CMP aware shuttle mask floorplanning, which is formulated as a rectangle packing problem with objectives of area and post-CMP topography variation minimization. We propose a 3-step procedure to solve the problem. First, we use the low-pass filter oxide CMP model to guide the simulated annealing search to minimize the topography variation. The result is then further improved by sliding each chip in its enclosing rectangle. Finally, we calculate the optimal amount of dummy feature needed with a linear programming method. Our experiment shows excellent results on real industry data.",
author = "Gang Xu and Ruiqi Tian and Pan, {David Z.} and Wong, {Martin D.F.}",
year = "2005",
doi = "10.1145/1120725.1120836",
language = "English (US)",
isbn = "0780387368",
series = "Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1111--1114",
booktitle = "Proceedings of the 2005 Asia and South Pacific Design Automation Conference, ASP-DAC 2005",
address = "United States",
note = "2005 Asia and South Pacific Design Automation Conference, ASP-DAC 2005 ; Conference date: 18-01-2005 Through 21-01-2005",
}