Chip-scale resonant gyrator for passive non-reciprocal devices

Songbin Gong (Inventor), Tomas Manzaneque Garcia (Inventor), Ruochen Lu (Inventor), Daniel Philip Shoemaker (Inventor), Cheng Tu (Inventor), Chengxi Zhao (Inventor)

Research output: Patent

Abstract

An integrated circuit is a layered device, on a semiconductor substrate, which contains metal electrodes that sandwich a piezoelectric layer, followed by a magnetostrictive layer and a metal coil. The metal electrodes define an electrical port across which to receive an alternating current (AC) voltage, which is applied across the piezoelectric layer to cause a time-varying strain in the piezoelectric layer. The magnetostrictive layer is to translate the time-varying strain, received by way of a vibration mode from interaction with the piezoelectric layer, into a time-varying electromagnetic field. The metal coil, disposed on the magnetostrictive layer, includes a magnetic port at which to induce a current based on exposure to the time-varying electromagnetic field generated by the magnetostrictive layer.
Original languageEnglish (US)
U.S. patent number10727804
StatePublished - Jul 28 2020

Fingerprint

Dive into the research topics of 'Chip-scale resonant gyrator for passive non-reciprocal devices'. Together they form a unique fingerprint.

Cite this