Abstract
In this paper, we present a chip-level electrothermal simulator, ILLIADS-T. It aims at finding the steady-state CMOS VLSI chip temperature profile and the corresponding circuit performance. With this tool, temperature-related reliability problems of VLSI chips can be accurately predicted to guide the module placement, packaging, as well as the timing verification.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 580-583 |
| Number of pages | 4 |
| Journal | Proceedings - IEEE International Symposium on Circuits and Systems |
| Volume | 4 |
| State | Published - 1996 |
| Event | Proceedings of the 1996 IEEE International Symposium on Circuits and Systems, ISCAS. Part 1 (of 4) - Atlanta, GA, USA Duration: May 12 1996 → May 15 1996 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering