In this paper, we present a chip-level electrothermal simulator, ILLIADS-T. It aims at finding the steady-state CMOS VLSI chip temperature profile and the corresponding circuit performance. With this tool, temperature-related reliability problems of VLSI chips can be accurately predicted to guide the module placement, packaging, as well as the timing verification.
|Original language||English (US)|
|Number of pages||4|
|Journal||Proceedings - IEEE International Symposium on Circuits and Systems|
|State||Published - 1996|
ASJC Scopus subject areas
- Electrical and Electronic Engineering