Characterization of magnetron-sputtered partially ionized deposition as a function of metal and gas species

Monica M.C. Allain, D. B. Hayden, D. R. Juliano, D. N. Ruzic

Research output: Contribution to journalArticle

Abstract

Effective utilization to fill trenches and vias with high aspect ratios of ionized metal fluxes were demonstrated by conventional magnetron sputter deposition with a rf inductively coupled plasma (ICP). The ICP was created with a seven turn, water cooled coil located between the magnetron cathode and the substrate. A gridded analyzer configured with a quartz crystal microbalance was located in the center of the substrate plane to determine the ion and neutral deposition rates. Deposition rates and ionization fractions were obtained under varying conditions. Results indicated that the ICP coil provide plasma throughout a larger volume and raising the electron temperature and density, which lead to increased ionization of the sputtered metal flux.

Original languageEnglish (US)
Pages (from-to)797-801
Number of pages5
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume18
Issue number3
DOIs
StatePublished - May 1 2000

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

Fingerprint Dive into the research topics of 'Characterization of magnetron-sputtered partially ionized deposition as a function of metal and gas species'. Together they form a unique fingerprint.

  • Cite this